Thermal Paste GD900

Thermal Paste GD900 for heat dissipation.

Key features:

• Electrically non-conductive
• Silicone-based
• Thermal conductivity:> 6.0W / mK
• Density:> 2.5
• Operating temperature: -50 ~ 240 ° C
• Colour: gray
• Item Type: Thermally Conductive Silicone Gel Cream
• Material: Oxidized Metal
• Application: CPU/GPU/LED Heat Dissipation
• Suitable to use on the CPU/GPU/LED, excellent thermally conductive function
• Used to connect heating unit with heat sink, reach better heat dissipation effect